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Description

STAY-CLEAN® paste soldering flux was designed primarily for copper-to-copper and copper-to-brass connection. In its paste form it is ideal for soldering tube joints. It is not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. This flux works well with most leaded and lead-free solder compositions. The flux residue should be removed after soldering.

Harris Products Group

STAY-CLEAN® Paste Soldering Flux POP

Item Code: HRWSCPF4POP

Category Brazing & Soldering Flux

Description

STAY-CLEAN® paste soldering flux was designed primarily for copper-to-copper and copper-to-brass connection. In its paste form it is ideal for soldering tube joints. It is not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. This flux works well with most leaded and lead-free solder compositions. The flux residue should be removed after soldering.

Harris Products Group

STAY-CLEAN® Paste Soldering Flux POP

Item Code: HRWSCPF4POP

Category Brazing & Soldering Flux

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STAY-CLEAN® Paste Soldering Flux POP

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STAY-CLEAN® Paste Soldering Flux POP

Description

Specifications

STAY-CLEAN® Paste Soldering Flux POP

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